Advantages and disadvantages of OSP surface treatment For PCBs that are more than six months old, a baking process is recommended before Surface Mount Technology (SMT) assembly. Another challenge with OSP is the difficulty in reusing misprinted boards. Cleaning agents such as alcohol can remove the OSP layer, exposing the Copper to oxidation, and thus, cleaned boards need to be promptly reprocessed. OSP boards are also vulnerable to solderability issues when exposed to multiple heating cycles, as repeated heating can degrade the OSP coating, compromising its protective qualities.
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