COB technology in Al based printed circuits COB, or Chip-on-Board, is a semiconductor assembly technology that directly attaches microchips to a substrate, bypassing traditional IC packaging. Substrates can be made of ceramic or flex materials, offering excellent dielectric and thermal properties. The COB manufacturing process involves die attachment, wire bonding, and encapsulation of die wires. Variants like FCOB (Flip-Chip-on-Board) eliminate wire bonding by directly connecting chips to the board, providing additional protection against chemical and mechanical damage through underfilling. COB technology differs significantly from conventional aluminum PCB manufacturing processes in terms of die attach, wire bonding, and encapsulation techniques.
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