The formation of Multilayer PCB The thickness of a multilayer PCB is determined by the selection of copper clad laminate (CCL), with consistency in the thickness and alignment of CCL and prepreg being crucial to prevent bending, especially in boards with more than six layers. Historically, electronic components were mounted on metal chassis with conductive wires, but advancements in printed circuit technology have shifted this to PCB-based assemblies, offering better electrical performance, higher reliability, smaller size, lower cost, and automated production. Multilayer PCBs, consisting of three or more layers interconnected by metalized holes, are used in large computer systems and electronic devices, with the technology evolving alongside microelectronics assembly techniques.
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