PCB stackup basic This Application Note provides guidance on planning high-speed multilayer PCB stackup configurations, focusing on both RF/analog and digital applications. RF/analog PCBs require low dielectric losses and uniform dielectric constant materials, often leading to the use of more expensive materials. Digital PCBs, characterized by high layer counts and complex via structures, prioritize processing costs, dimensional stability, and material choices like woven glass reinforcement and CAF materials. Properly designed PCB stackups improve signal integrity, reduce electromagnetic emissions and crosstalk, and enhance manufacturability. The goal is to achieve optimal performance while minimizing costs and ensuring long-term reliability.
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