Some general rules about Vias design The text provides guidelines for via design in PCB schematic layout, emphasizing the impact of vias on signal routing, parasitic effects, and overall PCB performance. It highlights the advantages and cost implications of using blind and buried vias in HDI designs, the importance of placing power and ground vias near IC power supply pins, and the role of ground vias in improving EMI and signal integrity. The text also discusses the thermal benefits and potential soldering issues with via-in-pad designs, especially in BGA/µBGA applications, and advises on considering mechanical performance when using high-density vias. Proper via design can enhance performance, reduce costs, and improve product stability.
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