Through hole and via hole technology in PCB Through-Hole Technology: Components are mounted by inserting leads through holes in the PCB and soldering them to copper traces on the opposite side. Boards can be single-sided or double-sided, with components soldered on one or both sides. Horizontal installation of through-hole parts involves bending leads and soldering them, which can be done manually or using wave soldering machines. Challenges and Limitations: Through-hole manufacturing requires precise drilling of many holes, adding to the board's cost and reducing routing space for signal traces on multi-layer boards. Surface-mount technology has since replaced through-hole mounting for smaller components, with through-hole used only for large, high-power, or mechanically stressed components.
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