PCB process description The PCB manufacturing process involves several key steps, including etching, drilling, conductor plating, solder resist application, testing, and assembling. Etching removes excess copper from the substrate, while drilling creates holes for component placement using tungsten carbide drill bits. The copper connections are then plated with materials like gold or tin to enable solderability. Solder resist material is applied to prevent unwanted soldering. PCBs are tested using methods like Bed of Nails or CT scanning. The final assembly involves placing components onto the PCB, either through-hole or surface-mount construction. The process requires a high level of technical expertise across various disciplines as electronics continue to evolve towards smaller, more compact designs.
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