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RF PCB is a high-frequency microwave RF PCB board made of polytetrafluoroethylene (PTFE PCB), ceramic filled fluoropolymers, or ceramic filled hydrocarbon thermosetting materials, with improved dielectric properties. This material has a low dielectric constant of 2.0-3.8, low loss factor, and excellent low loss characteristics. It also has good performance, high glass transition temperature, extremely low hydrophilicity, and excellent thermal stability The expansion coefficient of PTFE PCB material is similar to that of copper, which gives the material excellent dimensional stability.
The most critical considerations are controlling impedance routing, minimizing routing length, appropriate grounding techniques, layer stacking strategies, simulation/analysis, and selecting the correct microwave materials.
The selection of materials is based on the application of dielectric constant, loss tangent, frequency stability, thermal performance, and cost requirements. Important parameters include Dk tolerance, Df, Tg, and moisture absorption.
The sequential lamination process of automatic impedance control and testing ensures optimal impedance tolerance and reliability. Maintaining process control is crucial.
The testing includes impedance, high tank testing, time-domain reflection, VSWR measurement, thermal stress testing, and microscopic section analysis to confirm the integrity of the traces.
Carefully design the interfaces between circuit board layers, components, connectors, and external systems to ensure smooth transmission of RF signals. Simulation helps identify potential issues.
RF PCB is a high-frequency microwave RF PCB board made of polytetrafluoroethylene (PTFE PCB), ceramic filled fluoropolymers, or ceramic filled hydrocarbon thermosetting materials, with improved dielectric properties. This material has a low dielectric constant of 2.0-3.8, low loss factor, and excellent low loss characteristics. It also has good performance, high glass transition temperature, extremely low hydrophilicity, and excellent thermal stability The expansion coefficient of PTFE PCB material is similar to that of copper, which gives the material excellent dimensional stability.
The most critical considerations are controlling impedance routing, minimizing routing length, appropriate grounding techniques, layer stacking strategies, simulation/analysis, and selecting the correct microwave materials.
The selection of materials is based on the application of dielectric constant, loss tangent, frequency stability, thermal performance, and cost requirements. Important parameters include Dk tolerance, Df, Tg, and moisture absorption.
The sequential lamination process of automatic impedance control and testing ensures optimal impedance tolerance and reliability. Maintaining process control is crucial.
The testing includes impedance, high tank testing, time-domain reflection, VSWR measurement, thermal stress testing, and microscopic section analysis to confirm the integrity of the traces.
Carefully design the interfaces between circuit board layers, components, connectors, and external systems to ensure smooth transmission of RF signals. Simulation helps identify potential issues.
