I: Mature process experience and stable workers.
II: Newest machines and lines imported from Germany and Japan.
III: Strict feature control at each process.
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| Serial | Item | Technical Data |
| 1 | Types of Products |
FR4 Multilayer PCB, Aluminum PCB, Flexible PCB, Special Material PCB, Buried/Blind Via PCB,High Frequency PCB |
| 2 | Layers | 1－28(layers) |
| 3 | Max. Board Size | 520x1500mm |
| 4 | Max. Board Thickness | 3.2mm |
| 5 | Min. Board Thickness |
4（layers）0.40mm 16mil 6（layers）0.80mm 32mil 8（layers）1.00mm 40mil 10（layers）1.20mm 48mil |
| 6 | Copper Clad(Max.) | 8 oz(outer)/4 oz(inner) |
| 7 | Min. line Width/space | 0.075mm/0.075mm 3mil/3mil |
| 8 | Drill Size Mechanical (min.) | 0.15mm 6mil |
| 9 | Drill Size Laser(min.) | 0.10mm 4mil |
| 10 | PTH Wall Thickness | 0.025mm 1mil |
| 11 | PTH dia tolerance | ±0.075mm ±3mil |
| 12 | NPTH hole dia tolerance | ±0.05mm ±2mil |
| 13 | Hole Position Deviation | ±0.05mm ±2mil |
| 14 | Outline Tolerance | ±0.10mm ±4mil |
| 15 | S/M Pitch | 0.08mm 3mil |
| 16 | Insulation Resistance | 1E+12Ω(Normal) |
| 17 | Test Voltage | 50~300V |
| 18 | Aspect ratio | 12:1 |
| 19 | Thermal Shock | 3x10Sec@288 ℃ |
| 20 | Warp and Twist | ≤0.7% |
| 21 | Current breakdown | 10A |
| 22 | Electric Strength | ＞1.3KV/mm |
| 23 | Peel Strength | 1.4N/mm |
| 24 | Solder Mask Abrasion | ≥6H |
| 25 | Solder Mask Color |
Green, White, Yellow, Red Black, Blue, Purple. |
| 26 | Silkscreen Color | White, Yellow, Black |
| 27 | Flammability | 94V-0 |
| 28 | Impedance Control | +/-10%(＞50Ohm) +/-5% (≤50Ohm) |
| 29 | Buried Via | Yes |
| 30 | Blind Via | Yes |
| 31 | HDI | 2+N+2 4mil Via hole |
| 32 | Surface Finished |
ENIG,IMS,ImSn,OSP,HASL-LF,Carbon ink ENEPIG,Plating Gold |
| 33 | Materials | FR4, Aluminum,Polymide,Rogers etc. |
