Technical
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Identify the polarity of electronic components during PCBA processing
Means Which Can Prevent Component Shifting in SMT Processing
Skills of PCB prototype manual soldering
Reasons for the shift of Components in the SMT Process
Seven Types of PCB Probes
What Should Be Paid Attention to in Layout of High-frequency PCB
Precautions for PCB CCL Selection
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Detailed explanation of PCB manufacturing process and precautions
Detailed explanation of PCB manufacturing process and precautions
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Three basic elements of interference and how to suppression them.
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SMT Component Placement Process Of Parts : Manual Placement
SMT factory incoming PCB material inspection
Basic concepts commonly used in PCB design
Ideas and principles of High speed PCB layout
Component layout rules and safety distance considerations
SMT assembly process quality specification
5 points in PCB layout
Professional interpretation of SMT
Advantages and disadvantages of different PCB surface treatment
Special process in PCB prototype
Why the via hole become open after component assembly
Keep the cost of the PCB as low as possible
what are the causes of PCB board heating radiation problem
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How to Judge the Acceptance of PCB Quality
Which Color Circuit Board Sells the Most Expensive
Method to Solve the Noise Interference of Power Supply on High-frequency PCB Board
Disassembly Skills of Chip Components on PCB
What Factors Should Be Considered in the Selection of High-frequency PCB CCL
How to Place Special Components during PCB Layout
What Are the Functions of Capacitors in Circuits?
Testing Techniques for Common Electronics Components
What to do if There is a Short Circuit on the PCB
Desoldering Principles and knowhow during PCBA Processing
Black Oxidation of the Inner Layer of the Multilayer PCB
How to Ensure the High-performance Design of PCB
What Is the Printing Process of SMT Solder Paste?
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What Are the Benefits of Reserving Break-up Tab for PCB Production
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What Do Capacitive Coupling and Decoupling Mean?
What Are the Differences Between PCB Paste Mask and Solder Mask?
How PCBA Is Packaged and Shipped
How long can PCBA finished products be stored?
What Are the Differences and Relations Between PCB, PCBA, and SMT?
PCB Baking Specifications
PCB "Solder Mask Tenting" and "Solder Mask Opening"
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Content of PCB incoming testing
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PCBA Manufacturers Temperature and Humidity Sensitive Components Management
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How long does it take to calculate the quotation for PCBA manufacturing?
Introduction of PCB design clearance requirements
Explanation of BOM, DIP, SMT, SMD
Introduction of the process of PCBA prototype
How to prevent pseudo soldering or cold soldering defects in PCBA manufacturing?
Factors that affect the Price of FPCB
What information is required for SMT processing at PCBA factory?
Skills of using 0ohm resistor in PCB design
How to select a PCBA manufacturer
SMT processing solder joint quality inspection
Characteristics difference between immersion gold PCB and gold plating PCB
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A Few Rules about PCB Panelization
Compare of multi-layer PCB with single/double layer PCB
Why do we need to introduce so many subdivided GND
Difference between immersion gold boards and gold plating boards
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Classification of different GND in circuit
Why PCB baking is necessary during manufacturing process

How to Place Special Components during PCB Layout

In PCB design, there are usually multifarious PCB special components, and the layout of these special components is also very particular.

When designing how to place special components, first consider the size of the PCB. When the PCB size is too large, the printed lines will be too long, the impedance will increase, the resistance to interference will decrease, and the cost will increase; if it is too small, the heat dissipation will not be good, and adjacent lines will be easily interfered. After determining the PCB size, determine the position of the special component. Finally, array all components of the circuit according to functional units. The location of special components should generally follow the following principles when layout:

1. Try to shorten the connection between high-frequency components, minimize their distribution parameters and mutual electromagnetic interference. Components that are susceptible to interference should not be too close, and the input and output should be as far away as possible.

2. Some components or wires may have a high potential difference, so the distance between them should be increased to avoid accidental short circuits caused by discharge. High-voltage components should be placed out of reach as much as possible.

3. Parts weighing more than 15g can be fixed with brackets and then soldered. These heavy and hot components should not be placed on the circuit board, but on the shell bottom of the main box, and heat dissipation should be considered. Keep heat sensitive parts away from heating components.

4. For the layout of adjustable components such as potentiometers, adjustable inductance coils, variable capacitors and micro switches, the structural requirements of the entire board should be considered. If the structure allows, some commonly used switches should be placed in a position that is easily accessible by hand. The layout of the components should be balanced. The success of a product must firstly focus on the internal quality, and secondly, consider the overall aesthetics. And board that combines both can be a successful product.

PCB special components refer to the key components of the high-frequency part, the core components in the circuit, the susceptible components, the high-voltage components, the high-calorific value components, and some heterogeneous components. It is necessary to carefully analyze the location of these special components to make the layout meet the circuit function and production requirements. Improper placement may cause circuit compatibility issues and signal integrity issues, leading to PCB design failures.