Technical
How to Judge the Acceptance of PCB Quality
Which Color Circuit Board Sells the Most Expensive
Method to Solve the Noise Interference of Power Supply on High-frequency PCB Board
Disassembly Skills of Chip Components on PCB
What Factors Should Be Considered in the Selection of High-frequency PCB CCL
How to Place Special Components during PCB Layout
What Are the Functions of Capacitors in Circuits?
Testing Techniques for Common Electronics Components
What to do if There is a Short Circuit on the PCB
Desoldering Principles and knowhow during PCBA Processing
Black Oxidation of the Inner Layer of the Multilayer PCB
How to Ensure the High-performance Design of PCB
What Is the Printing Process of SMT Solder Paste?
PCB without fiducial mark, Is There Any Way to do SMT for It
What Are the Benefits of Reserving Break-up Tab for PCB Production
How Does SMT Affect PCB Production Time and Speed It Up
Classification of PCBs from three aspects
Common Problems and Solutions for Dry Film pasting during PCB Manufacturing process
Several Elements to Inspect after PCB Design
What is a halogen-free circuit board?
What Do Capacitive Coupling and Decoupling Mean?
What Are the Differences Between PCB Paste Mask and Solder Mask?
How PCBA Is Packaged and Shipped
How long can PCBA finished products be stored?
What Are the Differences and Relations Between PCB, PCBA, and SMT?
PCB Baking Specifications
PCB "Solder Mask Tenting" and "Solder Mask Opening"
Five reasons for PCB deformation and six solutions
Importance of first article inspection of PCBA board
Temperature zone standard for SMT reflow soldering
Small and medium volume PCB manufacturers in China
The main reason for PCBA cleaning
For power filter, the more capacitors, the better?
What does PCBA programming mean?
Content of PCB incoming testing
What conditions must be met for PCB circuit board soldering?
What is Blind via and Buried via
PCBA Manufacturers Temperature and Humidity Sensitive Components Management
Why choose Shenzhen SMT processing factory?
How long does it take to calculate the quotation for PCBA manufacturing?
Introduction of PCB design clearance requirements
Explanation of BOM, DIP, SMT, SMD
Introduction of the process of PCBA prototype
How to prevent pseudo soldering or cold soldering defects in PCBA manufacturing?
Factors that affect the Price of FPCB
What information is required for SMT processing at PCBA factory?
Skills of using 0ohm resistor in PCB design
How to select a PCBA manufacturer
SMT processing solder joint quality inspection
Characteristics difference between immersion gold PCB and gold plating PCB
Common malfunctions of Circuit Board Caused by Moisture
A Few Rules about PCB Panelization
Compare of multi-layer PCB with single/double layer PCB
Why do we need to introduce so many subdivided GND
Difference between immersion gold boards and gold plating boards
Aluminum PCB structure
Classification of different GND in circuit
Why PCB baking is necessary during manufacturing process
The handle and precautions of OSP board in SMT process
How to choose capacitors for filter decoupling
How to choose filter capacitor for switching power supply
5 database need for SMT process
Function of three-terminal capacitor
Introduction of PCB OSP surface treatment
Method of inspecting the quality of SMT by step
How to find the short point between VCC and GND
Difference between 850nm and 940nm infrared LED
Component layout of PCB SMT DFM
Pad shape influence on the strength and reliability of the soldering joints
The difference between high temperature solder paste and low temperature solder paste
Introduction to manual welding processing
Manual visual inspection in PCBA processing
Characteristics of the conformal coating process
Difference between hardware engineers and software engineers
PCBA processing operation rules
China PCB upstream materials has continued to soar
Difference between serial buses and parallel buses
The key points of quality control in PCBA processing
Common causes of solder beading during SMT process
Analysis of the advantages and disadvantages of HASL PCB surface
Requirements for layout of components during SMT assembly
Selection of electronic components and CCL for PCBA
Performance and appearance quality inspection of components.
Quality and Reliability of SMT Chip Processing and Production
Coupling and decoupling function of capacitor
Two methods to connect digital ground and analog ground
Common sense in SMT process

How Does SMT Affect PCB Production Time and Speed It Up

Most of today's mass-produced electronic hardware is manufactured using surface mounting technology. In addition to providing many other advantages, SMT has a long way to go in accelerating PCB production time. Today we will take a look at what methods are available to speed up PCB production time!

Surface mounting technology

Surface mount technology (SMT) concept evolved from through-hole manufacturing continues to provide significant improvements. By using SMT, the PCB does not need to be drilled. Instead, all SMT needs is to use solder paste. In addition to increasing a lot of speed, it significantly simplifies the process. Although SMT mounting components may not have the strength of through-hole mounting, they provide many other advantages to counteract this problem.

Surface mounting technology needs to go through 5 steps, the process is as follows: 1. PCB production---this is the stage where the PCB actually produces solder joints; 2. Solder is deposited on the pads, allowing components to be fixed to the circuit board; 3. With the help of the SMT machine, the components are placed precisely on solder joints; 4. Baking the PCB to harden the solder; 5. Checking the finished components.


The differences between SMT and through-hole include:

The widespread space problem in through-hole mounting is solved by using surface mounting technology. SMT also provides design flexibility because it provides PCB designers with the freedom to create dedicated circuits. Reducing component size means that more components can be accommodated on a single circuit board, and fewer circuit boards are required.
The components in the SMT are leadless. The shorter the lead length of SMC, the smaller the propagation delay, the smaller the package noise.

The density of components per unit area is higher because it allows components to be mounted on both sides, and it is suitable for mass production, thereby reducing costs.

The size reduction can increase the circuit speed. This is actually one of the main reasons why most manufacturers choose this method.

The surface tension of the molten solder pulls the component into alignment with the pad. This in turn will automatically correct any small errors that may have occurred in component placement.

SMT has proven to be more stable under vibration or large vibrations.

SMT parts are generally lower in cost than similar through-hole parts.

Importantly, SMT can greatly shorten the production time because no drilling is required. In addition, SMT components can be placed at a rate of thousands of placements per hour, while the installation volume for through-hole mounting is less than a thousand. This in turn leads to products being manufactured at the envisaged speed, which further shortens the time to market. If you are considering speeding up PCB production time, then SMT is clearly the answer. By using design for manufacturability (DFM) software tools, the need for rework and redesign of complex circuits is significantly reduced, and the speed and the possibility of complex designs are further improved.

All this is not to say that SMT has no inherent shortcomings. When SMT is used as the only attachment method for components facing a large amount of mechanical stress, SMT may be unreliable. It is impossible to mount components that generate a lot of heat or endure high electrical loads using SMT. This is because the solder can melt at high temperatures. Therefore, in the presence of special mechanical, electrical and thermal factors that make SMT invalid, through-hole mounting may continue to be used. In addition, SMT is not suitable for prototyping, because components may need to be added or replaced during the prototyping stage, and high-component density boards may be difficult to support.

With the powerful advantages provided by SMT, they have become today's main design and manufacturing standard, which is surprising. Basically they can be used in any situation where high reliability and high-volume PCBs are required.