How to Judge the Acceptance of PCB Quality
Which Color Circuit Board Sells the Most Expensive
Method to Solve the Noise Interference of Power Supply on High-frequency PCB Board
Disassembly Skills of Chip Components on PCB
What Factors Should Be Considered in the Selection of High-frequency PCB CCL
How to Place Special Components during PCB Layout
What Are the Functions of Capacitors in Circuits?
Testing Techniques for Common Electronics Components
What to do if There is a Short Circuit on the PCB
Desoldering Principles and knowhow during PCBA Processing
Black Oxidation of the Inner Layer of the Multilayer PCB
How to Ensure the High-performance Design of PCB
What Is the Printing Process of SMT Solder Paste?
PCB without fiducial mark, Is There Any Way to do SMT for It
What Are the Benefits of Reserving Break-up Tab for PCB Production
How Does SMT Affect PCB Production Time and Speed It Up
Classification of PCBs from three aspects
Common Problems and Solutions for Dry Film pasting during PCB Manufacturing process
Several Elements to Inspect after PCB Design
What is a halogen-free circuit board?
What Do Capacitive Coupling and Decoupling Mean?
What Are the Differences Between PCB Paste Mask and Solder Mask?
How PCBA Is Packaged and Shipped
How long can PCBA finished products be stored?
What Are the Differences and Relations Between PCB, PCBA, and SMT?
PCB Baking Specifications
PCB "Solder Mask Tenting" and "Solder Mask Opening"
Five reasons for PCB deformation and six solutions
Importance of first article inspection of PCBA board
Temperature zone standard for SMT reflow soldering
Small and medium volume PCB manufacturers in China
The main reason for PCBA cleaning
For power filter, the more capacitors, the better?
What does PCBA programming mean?
Content of PCB incoming testing
What conditions must be met for PCB circuit board soldering?
What is Blind via and Buried via
PCBA Manufacturers Temperature and Humidity Sensitive Components Management
Why choose Shenzhen SMT processing factory?
How long does it take to calculate the quotation for PCBA manufacturing?
Introduction of PCB design clearance requirements
Explanation of BOM, DIP, SMT, SMD
Introduction of the process of PCBA prototype
How to prevent pseudo soldering or cold soldering defects in PCBA manufacturing?
Factors that affect the Price of FPCB
What information is required for SMT processing at PCBA factory?
Skills of using 0ohm resistor in PCB design
How to select a PCBA manufacturer
SMT processing solder joint quality inspection
Characteristics difference between immersion gold PCB and gold plating PCB
Common malfunctions of Circuit Board Caused by Moisture
A Few Rules about PCB Panelization
Compare of multi-layer PCB with single/double layer PCB
Why do we need to introduce so many subdivided GND
Difference between immersion gold boards and gold plating boards
Aluminum PCB structure
Classification of different GND in circuit
Why PCB baking is necessary during manufacturing process
The handle and precautions of OSP board in SMT process
How to choose capacitors for filter decoupling
How to choose filter capacitor for switching power supply
5 database need for SMT process
Function of three-terminal capacitor
Introduction of PCB OSP surface treatment
Method of inspecting the quality of SMT by step
How to find the short point between VCC and GND
Difference between 850nm and 940nm infrared LED
Component layout of PCB SMT DFM
Pad shape influence on the strength and reliability of the soldering joints
The difference between high temperature solder paste and low temperature solder paste
Introduction to manual welding processing
Manual visual inspection in PCBA processing
Characteristics of the conformal coating process
Difference between hardware engineers and software engineers
PCBA processing operation rules
China PCB upstream materials has continued to soar
Difference between serial buses and parallel buses
The key points of quality control in PCBA processing
Common causes of solder beading during SMT process
Analysis of the advantages and disadvantages of HASL PCB surface
Requirements for layout of components during SMT assembly
Selection of electronic components and CCL for PCBA
Performance and appearance quality inspection of components.
Quality and Reliability of SMT Chip Processing and Production
Coupling and decoupling function of capacitor
Two methods to connect digital ground and analog ground
Common sense in SMT process

Common Problems and Solutions for Dry Film pasting during PCB Manufacturing process

With the continuous development of the electronics industry and the continuous upgrading of products, in order to save board space, many boards have been designed with very fine wires. The previous wet film manufacturing process can no longer meet the current graphics transfer process, and nowadays, fine wires are usually produced with dry film process, so what problems do we have in the PCB process of filming, China PCB manufacturer SYS Tech introduce to you as below. 

Summary of common problems and solutions for PCB paste dry film

(1) Air bubbles appear between the dry film and the surface of the copper foil
Problem: Choosing flat copper foil is the key to ensuring no bubbles.
Solution: Increase the pressure of the PCB film, and handle the CCL lightly.

Problem: The surface of the heat press roller is not flat, there are pits and the film is dirty.
Solution: Regularly check and protect the flatness of the surface of the heat press roller.

Problem: The temperature of the PCB film is too high, causing some contact materials to produce wrinkles due to temperature differences.
Solution: Reduce the temperature of the PCB film.

(2) The dry film is not firmly attached to the copper foil
Problem: The surface of the copper foil is not properly cleaned, and the direct operation will leave oil stains or oxide layers.
Solution: Wear gloves to conduct PCB cleaning.

Problem: The quality of the dry film solvent is not up to standard or has expired.
Solution: The PCB manufacturer should choose high-quality dry film and check the shelf life of the dry film regularly.

Problem: transfer speed is fast, while the PCB film temperature is low.
Solution: Change the PCB filming speed and PCB filming temperature.

Problem: The humidity in the processing environment is too high, which leads to a prolonged dry film bonding time.
Solution: Keep the relative humidity of the production environment at 50%.

(3) Dry film wrinkles
Problem: The dry film is too sticky, so be careful when placing the board during the operation.
Solution: Once contact occurs, it should be dealt with in time.

Problem: The board is overheated before the PCB filming.
Solution: The preheating temperature of the board should not be too high.

(4) Glue remains
Problem: The quality of the dry film is poor.
Solution: Replace the dry film.

Problem: The exposure time is too long.
Solution: Have an understanding of the materials used and carry out a reasonable exposure time.

Problem: the developer is ineffective.
Solution: Change the developer.