What conditions must be met for PCB circuit board soldering?_
Technical
PCB without fiducial mark, Is There Any Way to do SMT for It
What Are the Benefits of Reserving Break-up Tab for PCB Production
How Does SMT Affect PCB Production Time and Speed It Up
Classification of PCBs from three aspects
Common Problems and Solutions for Dry Film pasting during PCB Manufacturing process
Several Elements to Inspect after PCB Design
What is a halogen-free circuit board?
What Do Capacitive Coupling and Decoupling Mean?
What Are the Differences Between PCB Paste Mask and Solder Mask?
How PCBA Is Packaged and Shipped
How long can PCBA finished products be stored?
What Are the Differences and Relations Between PCB, PCBA, and SMT?
PCB Baking Specifications
PCB "Solder Mask Tenting" and "Solder Mask Opening"
Five reasons for PCB deformation and six solutions
Importance of first article inspection of PCBA board
Temperature zone standard for SMT reflow soldering
Small and medium volume PCB manufacturers in China
The main reason for PCBA cleaning
For power filter, the more capacitors, the better?
What does PCBA programming mean?
Content of PCB incoming testing
What conditions must be met for PCB circuit board soldering?
What is Blind via and Buried via
PCBA Manufacturers Temperature and Humidity Sensitive Components Management
Why choose Shenzhen SMT processing factory?
How long does it take to calculate the quotation for PCBA manufacturing?
Introduction of PCB design clearance requirements
Explanation of BOM, DIP, SMT, SMD
Introduction of the process of PCBA prototype
How to prevent pseudo soldering or cold soldering defects in PCBA manufacturing?
Factors that affect the Price of FPCB
What information is required for SMT processing at PCBA factory?
Skills of using 0ohm resistor in PCB design
How to select a PCBA manufacturer
SMT processing solder joint quality inspection
Characteristics difference between immersion gold PCB and gold plating PCB
Common malfunctions of Circuit Board Caused by Moisture
A Few Rules about PCB Panelization
Compare of multi-layer PCB with single/double layer PCB
Why do we need to introduce so many subdivided GND
Difference between immersion gold boards and gold plating boards
Aluminum PCB structure
Classification of different GND in circuit
Why PCB baking is necessary during manufacturing process
The handle and precautions of OSP board in SMT process
How is to choose capacitors for filter decoupling
How to choose filter capacitor for switching power supply
5 database need for SMT process
Function of three-terminal capacitor
Introduction of PCB OSP surface treatment
Method of inspecting the quality of SMT by step
How to find the short point between VCC and GND
Difference between 850nm and 940nm infrared LED
Component layout of PCB SMT DFM
Pad shape influence on the strength and reliability of the soldering joints
The difference between high temperature solder paste and low temperature solder paste
Introduction to manual welding processing
Manual visual inspection in PCBA processing
Characteristics of the conformal coating process
Difference between hardware engineers and software engineers
PCBA processing operation rules
China PCB upstream materials has continued to soar
Difference between serial buses and parallel buses
The key points of quality control in PCBA processing
Common causes of solder beading during SMT process
Analysis of the advantages and disadvantages of HASL PCB surface
Requirements for layout of components during SMT assembly
Selection of electronic components and CCL for PCBA
Performance and appearance quality inspection of components.
Quality and Reliability of SMT Chip Processing and Production
Coupling and decoupling function of capacitor
Two methods to connect digital ground and analog ground
Common sense in SMT process
Soldering solution to large heat absorption solder joints and easily oxidized pads
Reflow soldering stage in the BGA assembly process
Introduction of Capacitors
Practical method to use the AOI system at present
How to choose a LED placement machine
Explains and prospects of application LED in greenhouse plant
methods to improve the efficiency of FPC testing
The key points that affect the service life of soldering iron tip
PCBA product storage period
Design skills of RF PCB and microwave PCB
Replace IC skills to make PCB circuit design more perfect
PCB failure analysis
How to get an irregular shape PCB design

What conditions must be met for PCB circuit board soldering?

Soldering is the most important process in PCB circuit board manufacturing, and it plays a decisive role in the quality of the circuit board.

So, what conditions must be met for PCB circuit board soldering?

1. The components has good solderability
Solderability refers to the properties of an alloy that forms a good bond between the metal material to be soldered and the solder at an appropriate temperature. In order to improve the solderability, measures such as tin plating and silver plating on the surface can be used to prevent oxidation of the material surface.

2. The surface of the components must be kept clean
Even components with good solderability, due to storage or contamination, may produce oxide films and oil stains that are harmful to infiltration on the surface of the components. Be sure to remove the dirty film before soldering, otherwise the soldering quality cannot be guaranteed.

3. Use proper flux
The function of the flux is to clean out the oxide film on the surface of the components. Different soldering processes should choose different fluxes. When soldering precision electronic products, in order to make the soldering reliable and stable, usually use rosin-based flux.

4. The components should be heated to an appropriate temperature
When soldering, the function of heat energy is to melt the solder and heat the soldering object, so that the tin and lead can obtain enough energy to penetrate into the eutectoid on the surface of the soldered metal to form an alloy. If the soldering temperature is too low, it is easy to form a pseudo solder; if the soldering temperature is too high, the solder will be in a non-eutectic state and the quality of the solder will decrease.


5. Appropriate soldering time
Soldering time refers to the time required for physical and chemical changes in the entire soldering process. It includes the time for the soldered metal to reach the soldering temperature, the melting time of the solder, the time for the flux to function, and the time for the formation of metal alloys. When the soldering temperature is determined, the appropriate soldering time should be determined according to the shape, nature, and characteristics of the soldered components.