Technical
How to Judge the Acceptance of PCB Quality
Which Color Circuit Board Sells the Most Expensive
Method to Solve the Noise Interference of Power Supply on High-frequency PCB Board
Disassembly Skills of Chip Components on PCB
What Factors Should Be Considered in the Selection of High-frequency PCB CCL
How to Place Special Components during PCB Layout
What Are the Functions of Capacitors in Circuits?
Testing Techniques for Common Electronics Components
What to do if There is a Short Circuit on the PCB
Desoldering Principles and knowhow during PCBA Processing
Black Oxidation of the Inner Layer of the Multilayer PCB
How to Ensure the High-performance Design of PCB
What Is the Printing Process of SMT Solder Paste?
PCB without fiducial mark, Is There Any Way to do SMT for It
What Are the Benefits of Reserving Break-up Tab for PCB Production
How Does SMT Affect PCB Production Time and Speed It Up
Classification of PCBs from three aspects
Common Problems and Solutions for Dry Film pasting during PCB Manufacturing process
Several Elements to Inspect after PCB Design
What is a halogen-free circuit board?
What Do Capacitive Coupling and Decoupling Mean?
What Are the Differences Between PCB Paste Mask and Solder Mask?
How PCBA Is Packaged and Shipped
How long can PCBA finished products be stored?
What Are the Differences and Relations Between PCB, PCBA, and SMT?
PCB Baking Specifications
PCB "Solder Mask Tenting" and "Solder Mask Opening"
Five reasons for PCB deformation and six solutions
Importance of first article inspection of PCBA board
Temperature zone standard for SMT reflow soldering
Small and medium volume PCB manufacturers in China
The main reason for PCBA cleaning
For power filter, the more capacitors, the better?
What does PCBA programming mean?
Content of PCB incoming testing
What conditions must be met for PCB circuit board soldering?
What is Blind via and Buried via
PCBA Manufacturers Temperature and Humidity Sensitive Components Management
Why choose Shenzhen SMT processing factory?
How long does it take to calculate the quotation for PCBA manufacturing?
Introduction of PCB design clearance requirements
Explanation of BOM, DIP, SMT, SMD
Introduction of the process of PCBA prototype
How to prevent pseudo soldering or cold soldering defects in PCBA manufacturing?
Factors that affect the Price of FPCB
What information is required for SMT processing at PCBA factory?
Skills of using 0ohm resistor in PCB design
How to select a PCBA manufacturer
SMT processing solder joint quality inspection
Characteristics difference between immersion gold PCB and gold plating PCB
Common malfunctions of Circuit Board Caused by Moisture
A Few Rules about PCB Panelization
Compare of multi-layer PCB with single/double layer PCB
Why do we need to introduce so many subdivided GND
Difference between immersion gold boards and gold plating boards
Aluminum PCB structure
Classification of different GND in circuit
Why PCB baking is necessary during manufacturing process
The handle and precautions of OSP board in SMT process
How to choose capacitors for filter decoupling
How to choose filter capacitor for switching power supply
5 database need for SMT process
Function of three-terminal capacitor
Introduction of PCB OSP surface treatment
Method of inspecting the quality of SMT by step
How to find the short point between VCC and GND
Difference between 850nm and 940nm infrared LED
Component layout of PCB SMT DFM
Pad shape influence on the strength and reliability of the soldering joints
The difference between high temperature solder paste and low temperature solder paste
Introduction to manual welding processing
Manual visual inspection in PCBA processing
Characteristics of the conformal coating process
Difference between hardware engineers and software engineers
PCBA processing operation rules
China PCB upstream materials has continued to soar
Difference between serial buses and parallel buses
The key points of quality control in PCBA processing
Common causes of solder beading during SMT process
Analysis of the advantages and disadvantages of HASL PCB surface
Requirements for layout of components during SMT assembly
Selection of electronic components and CCL for PCBA
Performance and appearance quality inspection of components.
Quality and Reliability of SMT Chip Processing and Production
Coupling and decoupling function of capacitor
Two methods to connect digital ground and analog ground
Common sense in SMT process

Characteristics difference between immersion gold PCB and gold plating PCB

I: Immersion gold PCB board and electric gold PCB board:
1. Immersion gold board and chemical gold board are the same process product, electric gold board and flash gold board are also the same process product. In fact, it is just a different name from different people in the PCB industry. Immersion gold board and electric gold board are more common in the title of the mainland China PCB manufacturers, while the chemical gold board and the flash gold board are more commonly referred to by the Taiwan PCB manufacturers.

2. Immersion gold/chemical gold PCB is generally called chemical nickel gold PCB or chemical nickel immersion gold PCB. The growth of nickel/gold layer is generated by chemical deposition; electro gold PCB /flash gold PCB is generally called electroplated nickel gold PCB or flash gold PCB. The generation of the nickel/gold layer is plated by DC electroplating.

3. Refer to the table below for the difference in mechanism between electroless nickel gold plating (immersion gold) and electroplated nickel gold (gold plating):

Color Appearance Solderability Signal Transmission Quality Engineering
Gold plating PCB Gold with little white Normal, accidently pseudo solder conductor skin effect, not good for high frequency signal 1. Gold surface is easy oxidize
2. Gold wire may cause short
3. Bonding stress with soldermask is not good
No need Line Compensation, suit for small space
Gold immersion PCB Gold good conductor skin effect is small 1. Gold surface is not easy oxidize
2. No gold wire
3. Bonding stress with soldermask is good
Need Line compensation


II: Why do not use "HASL" for high end PCB?
1. As the integration level of IC becomes higher and higher, IC pins become denser. The vertical spray tin process is difficult to flatten the thin pads, which brings difficulty to the SMT process; in addition, the shelf life of the HASL PCB is very short. The immersion gold board just solves these problems

2. For the surface mount process, especially for 0603/0402 or ultra-small surface mount chips, because the flatness of the pad is directly related to the quality of the solder paste printing process, it has a decisive influence on the quality of the subsequent reflow soldering, so the gold immersion is common in high-density and ultra-small surface mount processes.

3. In the PCB prototype production stage, due to factors such as component procurement, it is often that the board is not soldered immediately, but it is often used for several weeks or even months. The shelf life of the gold-plated board is longer than that of lead-tin board, so everyone is willing to use it. Besides, the cost of the gold-plated PCB in the sample stage is almost the same as that of the HASL PCB board. But as the wiring becomes denser, the line width and spacing have reached 3-4mil, gold plating process also brings about the problem of short circuit of gold wire.

As the frequency of the signal gets higher and higher, the skin effect of signal transmission in the multi-plated layer has more obvious influence on the signal quality:
The skin effect refers to: high frequency alternating current, the current will tend to concentrate on the surface of the wire to flow. According to calculations, skin effect depth is related to frequency.