Technical
How to Judge the Acceptance of PCB Quality
Which Color Circuit Board Sells the Most Expensive
Method to Solve the Noise Interference of Power Supply on High-frequency PCB Board
Disassembly Skills of Chip Components on PCB
What Factors Should Be Considered in the Selection of High-frequency PCB CCL
How to Place Special Components during PCB Layout
What Are the Functions of Capacitors in Circuits?
Testing Techniques for Common Electronics Components
What to do if There is a Short Circuit on the PCB
Desoldering Principles and knowhow during PCBA Processing
Black Oxidation of the Inner Layer of the Multilayer PCB
How to Ensure the High-performance Design of PCB
What Is the Printing Process of SMT Solder Paste?
PCB without fiducial mark, Is There Any Way to do SMT for It
What Are the Benefits of Reserving Break-up Tab for PCB Production
How Does SMT Affect PCB Production Time and Speed It Up
Classification of PCBs from three aspects
Common Problems and Solutions for Dry Film pasting during PCB Manufacturing process
Several Elements to Inspect after PCB Design
What is a halogen-free circuit board?
What Do Capacitive Coupling and Decoupling Mean?
What Are the Differences Between PCB Paste Mask and Solder Mask?
How PCBA Is Packaged and Shipped
How long can PCBA finished products be stored?
What Are the Differences and Relations Between PCB, PCBA, and SMT?
PCB Baking Specifications
PCB "Solder Mask Tenting" and "Solder Mask Opening"
Five reasons for PCB deformation and six solutions
Importance of first article inspection of PCBA board
Temperature zone standard for SMT reflow soldering
Small and medium volume PCB manufacturers in China
The main reason for PCBA cleaning
For power filter, the more capacitors, the better?
What does PCBA programming mean?
Content of PCB incoming testing
What conditions must be met for PCB circuit board soldering?
What is Blind via and Buried via
PCBA Manufacturers Temperature and Humidity Sensitive Components Management
Why choose Shenzhen SMT processing factory?
How long does it take to calculate the quotation for PCBA manufacturing?
Introduction of PCB design clearance requirements
Explanation of BOM, DIP, SMT, SMD
Introduction of the process of PCBA prototype
How to prevent pseudo soldering or cold soldering defects in PCBA manufacturing?
Factors that affect the Price of FPCB
What information is required for SMT processing at PCBA factory?
Skills of using 0ohm resistor in PCB design
How to select a PCBA manufacturer
SMT processing solder joint quality inspection
Characteristics difference between immersion gold PCB and gold plating PCB
Common malfunctions of Circuit Board Caused by Moisture
A Few Rules about PCB Panelization
Compare of multi-layer PCB with single/double layer PCB
Why do we need to introduce so many subdivided GND
Difference between immersion gold boards and gold plating boards
Aluminum PCB structure
Classification of different GND in circuit
Why PCB baking is necessary during manufacturing process
The handle and precautions of OSP board in SMT process
How to choose capacitors for filter decoupling
How to choose filter capacitor for switching power supply
5 database need for SMT process
Function of three-terminal capacitor
Introduction of PCB OSP surface treatment
Method of inspecting the quality of SMT by step
How to find the short point between VCC and GND
Difference between 850nm and 940nm infrared LED
Component layout of PCB SMT DFM
Pad shape influence on the strength and reliability of the soldering joints
The difference between high temperature solder paste and low temperature solder paste
Introduction to manual welding processing
Manual visual inspection in PCBA processing
Characteristics of the conformal coating process
Difference between hardware engineers and software engineers
PCBA processing operation rules
China PCB upstream materials has continued to soar
Difference between serial buses and parallel buses
The key points of quality control in PCBA processing
Common causes of solder beading during SMT process
Analysis of the advantages and disadvantages of HASL PCB surface
Requirements for layout of components during SMT assembly
Selection of electronic components and CCL for PCBA
Performance and appearance quality inspection of components.
Quality and Reliability of SMT Chip Processing and Production
Coupling and decoupling function of capacitor
Two methods to connect digital ground and analog ground
Common sense in SMT process

The handle and precautions of OSP board in SMT process

a. Before opening the PCB vacuum package, check whether the PCB packaging is damaged and whether the humidity indicator card is discolored. If it is damaged or discolored, it cannot be used, need bake before start SMT. OSP PCB needs to be start production within 8 hours after opening. It is recommended to open packages as less as possible according to SMT quantity, and vacuum packaging should be applied in time for PCBs that have not been used.

b. It is necessary to control the temperature and humidity of the SMT workshop. It is recommended that the workshop set temperature: 25±3℃, humidity: 50±10%. During the SMT production process, it is forbidden to directly touch the surface of the PCB pad with bare hands to prevent sweat pollution, causing oxidation and leading to poor soldering.

c. After printing solder paste, components should be mounted and pass the reflow oven as soon as possible. Try to avoid printing errors or mounting problems leading to PCB washing during SMT process, because washing PCB surface will damage the OSP film, if you do need to wash the board, do not use high volatile solvent to soak PCB for cleaning, it is recommended to wipe off the solder paste with a non-woven cloth dipped in 75% alcohol. The PCB after cleaning must be soldered within 2 hours.

d. After the first side SMT is completed, the placement of the second side SMT components needs to be completed within 24 hours, and the selective soldering or wave soldering of the DIP (plug-in) components must be completed within 36 hours.

e. Since the solder paste on OSP surface PCB has poorer fluidity than other surface treatment PCBs, the solder joints are likely to expose copper. When designing the stencil opening, you can increase it appropriately. It is recommended to open the hole according to the pad with ratio 1:1.05 or 1:1.1, but you need to pay attention to the anti-tin bead treatment of the chip component.

f. The peak temperature and reflow time of the OSP board during reflow soldering are recommended to be as close to the lower limit of the process as possible when the soldering quality is satisfied. when mounting double-sided PCBs, it is recommended The temperature of the first side reflow (the small component side) should be lowered appropriately, and the temperature on both sides should be set separately to reduce the damage of high temperature to the OSP film. If possible, it is recommended to use nitrogen reflow oven, which can effectively improve the problem of oxidation and poor soldering of the second side of the double-sided OSP board.