Technical
PCB related knowledge- The purpose of each layer of the PCB
How to do heat resistance testing for PCB board
Detailed explanation of rigid-flex board and IC carrier board
PCBA prototype procedure
Defects which can be detected by the SPI
What are the spacing requirements for designing PCB circuit boards?
What are the classification and advantages of PCB metal substrates?
Difference between the processing technology of 1Layer AL PCB and 2Layer AL PCB
Introduction of FPC Cable and its usage
advantages of Shenzhen SMT assembly factory
inspection items before PCB ordering
usages of ceramic substrates
main applications of PCB boards
Cost-effective PCB product services
How to check short circuit of a circuit board during manual soldering
Identify the polarity of electronic components during PCBA processing
Means Which Can Prevent Component Shifting in SMT Processing
Skills of PCB prototype manual soldering
Reasons for the shift of Components in the SMT Process
Seven Types of PCB Probes
What Should Be Paid Attention to in Layout of High-frequency PCB
Precautions for PCB CCL Selection
Advantages of LED Plant growth light
Advantages of using LED grow lights to grow industrial hemp
Detailed explanation of PCB manufacturing process and precautions
Detailed explanation of PCB manufacturing process and precautions
How to draw multilayer PCB on Altium Designer
Three basic elements of interference and how to suppression them.
Decrease interference between digital circuit and analog circuit
SMT Component Placement Process Of Parts : Manual Placement
SMT factory incoming PCB material inspection
Basic concepts commonly used in PCB design
Ideas and principles of High speed PCB layout
Component layout rules and safety distance considerations
SMT assembly process quality specification
5 points in PCB layout
Professional interpretation of SMT
Advantages and disadvantages of different PCB surface treatment
Special process in PCB prototype
Why the via hole become open after component assembly
Keep the cost of the PCB as low as possible
what are the causes of PCB board heating radiation problem
Pad size and via diameter dimensions consideration in PCB prototyping
How to Judge the Acceptance of PCB Quality
Which Color Circuit Board Sells the Most Expensive
Method to Solve the Noise Interference of Power Supply on High-frequency PCB Board
Disassembly Skills of Chip Components on PCB
What Factors Should Be Considered in the Selection of High-frequency PCB CCL
How to Place Special Components during PCB Layout
What Are the Functions of Capacitors in Circuits?
Testing Techniques for Common Electronics Components
What to do if There is a Short Circuit on the PCB
Desoldering Principles and knowhow during PCBA Processing
Black Oxidation of the Inner Layer of the Multilayer PCB
How to Ensure the High-performance Design of PCB
What Is the Printing Process of SMT Solder Paste?
PCB without fiducial mark, Is There Any Way to do SMT for It
What Are the Benefits of Reserving Break-up Tab for PCB Production
How Does SMT Affect PCB Production Time and Speed It Up
Classification of PCBs from three aspects
Common Problems and Solutions for Dry Film pasting during PCB Manufacturing process
Several Elements to Inspect after PCB Design
What is a halogen-free circuit board?
What Do Capacitive Coupling and Decoupling Mean?
What Are the Differences Between PCB Paste Mask and Solder Mask?
How PCBA Is Packaged and Shipped
How long can PCBA finished products be stored?
What Are the Differences and Relations Between PCB, PCBA, and SMT?
PCB Baking Specifications
PCB "Solder Mask Tenting" and "Solder Mask Opening"
Five reasons for PCB deformation and six solutions
Importance of first article inspection of PCBA board
Temperature zone standard for SMT reflow soldering
Small and medium volume PCB manufacturers in China
The main reason for PCBA cleaning
For power filter, the more capacitors, the better?
What does PCBA programming mean?
Content of PCB incoming testing
What conditions must be met for PCB circuit board soldering?
What is Blind via and Buried via
PCBA Manufacturers Temperature and Humidity Sensitive Components Management
Why choose Shenzhen SMT processing factory?
How long does it take to calculate the quotation for PCBA manufacturing?
Introduction of PCB design clearance requirements
Explanation of BOM, DIP, SMT, SMD
Introduction of the process of PCBA prototype
How to prevent pseudo soldering or cold soldering defects in PCBA manufacturing?

The handle and precautions of OSP board in SMT process

a. Before opening the PCB vacuum package, check whether the PCB packaging is damaged and whether the humidity indicator card is discolored. If it is damaged or discolored, it cannot be used, need bake before start SMT. OSP PCB needs to be start production within 8 hours after opening. It is recommended to open packages as less as possible according to SMT quantity, and vacuum packaging should be applied in time for PCBs that have not been used.

b. It is necessary to control the temperature and humidity of the SMT workshop. It is recommended that the workshop set temperature: 25±3℃, humidity: 50±10%. During the SMT production process, it is forbidden to directly touch the surface of the PCB pad with bare hands to prevent sweat pollution, causing oxidation and leading to poor soldering.

c. After printing solder paste, components should be mounted and pass the reflow oven as soon as possible. Try to avoid printing errors or mounting problems leading to PCB washing during SMT process, because washing PCB surface will damage the OSP film, if you do need to wash the board, do not use high volatile solvent to soak PCB for cleaning, it is recommended to wipe off the solder paste with a non-woven cloth dipped in 75% alcohol. The PCB after cleaning must be soldered within 2 hours.

d. After the first side SMT is completed, the placement of the second side SMT components needs to be completed within 24 hours, and the selective soldering or wave soldering of the DIP (plug-in) components must be completed within 36 hours.

e. Since the solder paste on OSP surface PCB has poorer fluidity than other surface treatment PCBs, the solder joints are likely to expose copper. When designing the stencil opening, you can increase it appropriately. It is recommended to open the hole according to the pad with ratio 1:1.05 or 1:1.1, but you need to pay attention to the anti-tin bead treatment of the chip component.

f. The peak temperature and reflow time of the OSP board during reflow soldering are recommended to be as close to the lower limit of the process as possible when the soldering quality is satisfied. when mounting double-sided PCBs, it is recommended The temperature of the first side reflow (the small component side) should be lowered appropriately, and the temperature on both sides should be set separately to reduce the damage of high temperature to the OSP film. If possible, it is recommended to use nitrogen reflow oven, which can effectively improve the problem of oxidation and poor soldering of the second side of the double-sided OSP board.