How to Judge the Acceptance of PCB Quality
Which Color Circuit Board Sells the Most Expensive
Method to Solve the Noise Interference of Power Supply on High-frequency PCB Board
Disassembly Skills of Chip Components on PCB
What Factors Should Be Considered in the Selection of High-frequency PCB CCL
How to Place Special Components during PCB Layout
What Are the Functions of Capacitors in Circuits?
Testing Techniques for Common Electronics Components
What to do if There is a Short Circuit on the PCB
Desoldering Principles and knowhow during PCBA Processing
Black Oxidation of the Inner Layer of the Multilayer PCB
How to Ensure the High-performance Design of PCB
What Is the Printing Process of SMT Solder Paste?
PCB without fiducial mark, Is There Any Way to do SMT for It
What Are the Benefits of Reserving Break-up Tab for PCB Production
How Does SMT Affect PCB Production Time and Speed It Up
Classification of PCBs from three aspects
Common Problems and Solutions for Dry Film pasting during PCB Manufacturing process
Several Elements to Inspect after PCB Design
What is a halogen-free circuit board?
What Do Capacitive Coupling and Decoupling Mean?
What Are the Differences Between PCB Paste Mask and Solder Mask?
How PCBA Is Packaged and Shipped
How long can PCBA finished products be stored?
What Are the Differences and Relations Between PCB, PCBA, and SMT?
PCB Baking Specifications
PCB "Solder Mask Tenting" and "Solder Mask Opening"
Five reasons for PCB deformation and six solutions
Importance of first article inspection of PCBA board
Temperature zone standard for SMT reflow soldering
Small and medium volume PCB manufacturers in China
The main reason for PCBA cleaning
For power filter, the more capacitors, the better?
What does PCBA programming mean?
Content of PCB incoming testing
What conditions must be met for PCB circuit board soldering?
What is Blind via and Buried via
PCBA Manufacturers Temperature and Humidity Sensitive Components Management
Why choose Shenzhen SMT processing factory?
How long does it take to calculate the quotation for PCBA manufacturing?
Introduction of PCB design clearance requirements
Explanation of BOM, DIP, SMT, SMD
Introduction of the process of PCBA prototype
How to prevent pseudo soldering or cold soldering defects in PCBA manufacturing?
Factors that affect the Price of FPCB
What information is required for SMT processing at PCBA factory?
Skills of using 0ohm resistor in PCB design
How to select a PCBA manufacturer
SMT processing solder joint quality inspection
Characteristics difference between immersion gold PCB and gold plating PCB
Common malfunctions of Circuit Board Caused by Moisture
A Few Rules about PCB Panelization
Compare of multi-layer PCB with single/double layer PCB
Why do we need to introduce so many subdivided GND
Difference between immersion gold boards and gold plating boards
Aluminum PCB structure
Classification of different GND in circuit
Why PCB baking is necessary during manufacturing process
The handle and precautions of OSP board in SMT process
How to choose capacitors for filter decoupling
How to choose filter capacitor for switching power supply
5 database need for SMT process
Function of three-terminal capacitor
Introduction of PCB OSP surface treatment
Method of inspecting the quality of SMT by step
How to find the short point between VCC and GND
Difference between 850nm and 940nm infrared LED
Component layout of PCB SMT DFM
Pad shape influence on the strength and reliability of the soldering joints
The difference between high temperature solder paste and low temperature solder paste
Introduction to manual welding processing
Manual visual inspection in PCBA processing
Characteristics of the conformal coating process
Difference between hardware engineers and software engineers
PCBA processing operation rules
China PCB upstream materials has continued to soar
Difference between serial buses and parallel buses
The key points of quality control in PCBA processing
Common causes of solder beading during SMT process
Analysis of the advantages and disadvantages of HASL PCB surface
Requirements for layout of components during SMT assembly
Selection of electronic components and CCL for PCBA
Performance and appearance quality inspection of components.
Quality and Reliability of SMT Chip Processing and Production
Coupling and decoupling function of capacitor
Two methods to connect digital ground and analog ground
Common sense in SMT process

Manual visual inspection in PCBA processing

PCBA processing plants attach great importance to quality inspection work, and there are many common quality inspection methods. Manual visual inspection is a cost-effective inspection method for PCBA factories with low process requirements and imperfect equipment. Manual visual inspection in PCBA processing can effectively reduce production defects and improve shipment qualification rate. 

Manual visual inspection includes: manual inspection of solder paste printing, manual visual inspection of glue printing, manual visual inspection of solder joints, visual inspection of PCB surface quality and so on. Next, China PCBA processing factory SYS Technology will give you a brief introduction to the main purpose of manual visual inspection.

1. Solder paste printing
First, check whether the basic parameter settings of the solder paste printer are appropriate. The solder paste is printed on the PCB pad, whether the height of the solder paste is the same or presents a "trapezoid" shape, and the edges of the solder paste should not have rounded corners or collapse into a pile shape, but allow some peak shapes caused by pulling up a small amount of solder paste when the stencil is separated. If the solder paste is unevenly distributed, it is necessary to check whether the solder paste on the squeegee is insufficient or distributed uneven, also need to check the printing stencil and other basic parameters. Then check under the microscope whether the solder paste is bright after printing.

2. Placement of electronic devices
Before mount electronic components to the first PCB with solder paste applied, check whether the material racks are properly placed, whether the electronic components are correct, and whether the machine's picking position is appropriate. After completing placement of components to the first PCB, check in detail to see if each electronic component is properly placed and lightly pressed in the center of the solder paste instead of just being "placed" on top of the solder paste. 

If you can see a slight depression of the solder paste in the microscope, it means it is placed properly. Are all the electronic devices on the bill of materials (BOM) the same as the electronic devices on the PCBA? All electronic devices that with positive and negative poles, such as diodes, tantalum electrolytic capacitors and ICs, are the orientation of them correct?