Requirements for layout of components during SMT assembly,China SMT factory SYS Tech_
Technical
PCB related knowledge- The purpose of each layer of the PCB
How to do heat resistance testing for PCB board
Detailed explanation of rigid-flex board and IC carrier board
PCBA prototype procedure
Defects which can be detected by the SPI
What are the spacing requirements for designing PCB circuit boards?
What are the classification and advantages of PCB metal substrates?
Difference between the processing technology of 1Layer AL PCB and 2Layer AL PCB
Introduction of FPC Cable and its usage
advantages of Shenzhen SMT assembly factory
inspection items before PCB ordering
usages of ceramic substrates
main applications of PCB boards
Cost-effective PCB product services
How to check short circuit of a circuit board during manual soldering
Identify the polarity of electronic components during PCBA processing
Means Which Can Prevent Component Shifting in SMT Processing
Skills of PCB prototype manual soldering
Reasons for the shift of Components in the SMT Process
Seven Types of PCB Probes
What Should Be Paid Attention to in Layout of High-frequency PCB
Precautions for PCB CCL Selection
Advantages of LED Plant growth light
Advantages of using LED grow lights to grow industrial hemp
Detailed explanation of PCB manufacturing process and precautions
Detailed explanation of PCB manufacturing process and precautions
How to draw multilayer PCB on Altium Designer
Three basic elements of interference and how to suppression them.
Decrease interference between digital circuit and analog circuit
SMT Component Placement Process Of Parts : Manual Placement
SMT factory incoming PCB material inspection
Basic concepts commonly used in PCB design
Ideas and principles of High speed PCB layout
Component layout rules and safety distance considerations
SMT assembly process quality specification
5 points in PCB layout
Professional interpretation of SMT
Advantages and disadvantages of different PCB surface treatment
Special process in PCB prototype
Why the via hole become open after component assembly
Keep the cost of the PCB as low as possible
what are the causes of PCB board heating radiation problem
Pad size and via diameter dimensions consideration in PCB prototyping
How to Judge the Acceptance of PCB Quality
Which Color Circuit Board Sells the Most Expensive
Method to Solve the Noise Interference of Power Supply on High-frequency PCB Board
Disassembly Skills of Chip Components on PCB
What Factors Should Be Considered in the Selection of High-frequency PCB CCL
How to Place Special Components during PCB Layout
What Are the Functions of Capacitors in Circuits?
Testing Techniques for Common Electronics Components
What to do if There is a Short Circuit on the PCB
Desoldering Principles and knowhow during PCBA Processing
Black Oxidation of the Inner Layer of the Multilayer PCB
How to Ensure the High-performance Design of PCB
What Is the Printing Process of SMT Solder Paste?
PCB without fiducial mark, Is There Any Way to do SMT for It
What Are the Benefits of Reserving Break-up Tab for PCB Production
How Does SMT Affect PCB Production Time and Speed It Up
Classification of PCBs from three aspects
Common Problems and Solutions for Dry Film pasting during PCB Manufacturing process
Several Elements to Inspect after PCB Design
What is a halogen-free circuit board?
What Do Capacitive Coupling and Decoupling Mean?
What Are the Differences Between PCB Paste Mask and Solder Mask?
How PCBA Is Packaged and Shipped
How long can PCBA finished products be stored?
What Are the Differences and Relations Between PCB, PCBA, and SMT?
PCB Baking Specifications
PCB "Solder Mask Tenting" and "Solder Mask Opening"
Five reasons for PCB deformation and six solutions
Importance of first article inspection of PCBA board
Temperature zone standard for SMT reflow soldering
Small and medium volume PCB manufacturers in China
The main reason for PCBA cleaning
For power filter, the more capacitors, the better?
What does PCBA programming mean?
Content of PCB incoming testing
What conditions must be met for PCB circuit board soldering?
What is Blind via and Buried via
PCBA Manufacturers Temperature and Humidity Sensitive Components Management
Why choose Shenzhen SMT processing factory?
How long does it take to calculate the quotation for PCBA manufacturing?
Introduction of PCB design clearance requirements
Explanation of BOM, DIP, SMT, SMD
Introduction of the process of PCBA prototype
How to prevent pseudo soldering or cold soldering defects in PCBA manufacturing?

Requirements for layout of components during SMT assembly

The production process of SMT processing has certain requirements for the layout of components. Different processes, such as wave soldering, single-sided reflow soldering, double-sided reflow soldering, etc., have different requirements. Below, Shenzhen SYS Technology, a SMT processing manufacturer, briefly introduces the requirements for layout of components during SMT assembly.

1. The distribution of components on the PCBA should be as even as possible.

2. Arrangement angle of electronic components on the PCB, the same type of electronic components should be arranged at the same angle as much as possible, and the characteristic angle should be kept consistent, which is conducive to the mounting, soldering and testing of electronic components.

3. It should be vacant around the large electronic components, such as BGA, QFP etc., so that the SMD rework equipment with big heating header that can be operated on it.

4. Heat radiating electronic components should be as far away as possible from other electronic components, usually placed in the corners, ventilated positions in the chassis. Heat radiating electronic components should be supported by other leads or other supports (for example, heat sinks can be added) to keep the heat-generating electronic components and the PCB surface at a certain distance, with a minimum distance of 2mm.

5. Temperature sensitive electronic components should be kept away from heating radiating electronic components.

6. The layout of electronic components and parts that need to be adjusted or replaced frequently, should be considered with the whole structure of the equipment requires, such as potentiometers, adjustable inductance coils, variable capacitor micro switches, fuses, buttons, plugs and other electronic components, should be placed in a position conducive to adjustment and replacement.

7. Fixing holes should be arranged near the connection terminals, plug-in parts, and the center of the long series of terminals where the force is often applied from time to time. At the same time, a corresponding space should be reserved around the fixing holes to avoid deformation due to thermal expansion.

8. The distance between some electronic components, spare parts and other electronic components that require secondary processing due to large volume tolerances and low precision is increased by a certain margin on the basis of the original setting.

9. It is recommended that the margin of electrolytic capacitors, varistors, bridge stacks, polyester capacitors, etc. is not less than 1mm, and transformers, radiators and resistances exceeding 5W (including 5W) are not less than 3mm.

10. Electrolytic capacitors should not touch heating electronic components, such as high-power resistance thermistors, transformers, radiators, etc.

11. The stress-sensitive electronic components cannot be placed on the corners, edges of the PCB or near the connectors, mounting holes, slots, cutouts, gaps and corners.

12. The layout of electronic components must meet the process requirements and spacing requirements of reflow soldering and wave soldering.

13. The PCB positioning hole and the position occupied by the fixing bracket should be vacated.

14. In the large-area PCB design plan with an area exceeding 500cm2, in order to avoid PCB bending when passing through the reflow furnace, a 5~10mm wide gap should be left in the middle of the PCB without electronic components (wires can be routed). In order add press bar to avoid PCB bending when going through the tin furnace.
I. The placement angle of electronic components should take into account the angle at which the PCB enters the reflow oven.
II. The long axis of the two end chip electronic components on the PCBA should be perpendicular to the angle of the conveyor belt of the reflow oven.
III. The long axis of the SMD electronic components should be parallel to the transmission angle of the reflow oven, and the long axis of the Chip electronic components at the two ends and the long axis of the SMD electronic components should be perpendicular to each other.
IV. A good layout design plan of electronic components should take into account the symmetrical heat capacity and the arrangement angle and order of the electronic components.
V. For large-size PCBs, in order to keep the temperature on both sides of the PCB as consistent as possible, the long side of the PCB should be parallel to the angle of the conveyor belt of the reflow oven.

15. Installation spacing of electronic components: The minimum installation spacing of electronic components must meet the manufacturability, testability and maintainability requirements of SMT assembly.