Technical
How to Judge the Acceptance of PCB Quality
Which Color Circuit Board Sells the Most Expensive
Method to Solve the Noise Interference of Power Supply on High-frequency PCB Board
Disassembly Skills of Chip Components on PCB
What Factors Should Be Considered in the Selection of High-frequency PCB CCL
How to Place Special Components during PCB Layout
What Are the Functions of Capacitors in Circuits?
Testing Techniques for Common Electronics Components
What to do if There is a Short Circuit on the PCB
Desoldering Principles and knowhow during PCBA Processing
Black Oxidation of the Inner Layer of the Multilayer PCB
How to Ensure the High-performance Design of PCB
What Is the Printing Process of SMT Solder Paste?
PCB without fiducial mark, Is There Any Way to do SMT for It
What Are the Benefits of Reserving Break-up Tab for PCB Production
How Does SMT Affect PCB Production Time and Speed It Up
Classification of PCBs from three aspects
Common Problems and Solutions for Dry Film pasting during PCB Manufacturing process
Several Elements to Inspect after PCB Design
What is a halogen-free circuit board?
What Do Capacitive Coupling and Decoupling Mean?
What Are the Differences Between PCB Paste Mask and Solder Mask?
How PCBA Is Packaged and Shipped
How long can PCBA finished products be stored?
What Are the Differences and Relations Between PCB, PCBA, and SMT?
PCB Baking Specifications
PCB "Solder Mask Tenting" and "Solder Mask Opening"
Five reasons for PCB deformation and six solutions
Importance of first article inspection of PCBA board
Temperature zone standard for SMT reflow soldering
Small and medium volume PCB manufacturers in China
The main reason for PCBA cleaning
For power filter, the more capacitors, the better?
What does PCBA programming mean?
Content of PCB incoming testing
What conditions must be met for PCB circuit board soldering?
What is Blind via and Buried via
PCBA Manufacturers Temperature and Humidity Sensitive Components Management
Why choose Shenzhen SMT processing factory?
How long does it take to calculate the quotation for PCBA manufacturing?
Introduction of PCB design clearance requirements
Explanation of BOM, DIP, SMT, SMD
Introduction of the process of PCBA prototype
How to prevent pseudo soldering or cold soldering defects in PCBA manufacturing?
Factors that affect the Price of FPCB
What information is required for SMT processing at PCBA factory?
Skills of using 0ohm resistor in PCB design
How to select a PCBA manufacturer
SMT processing solder joint quality inspection
Characteristics difference between immersion gold PCB and gold plating PCB
Common malfunctions of Circuit Board Caused by Moisture
A Few Rules about PCB Panelization
Compare of multi-layer PCB with single/double layer PCB
Why do we need to introduce so many subdivided GND
Difference between immersion gold boards and gold plating boards
Aluminum PCB structure
Classification of different GND in circuit
Why PCB baking is necessary during manufacturing process
The handle and precautions of OSP board in SMT process
How to choose capacitors for filter decoupling
How to choose filter capacitor for switching power supply
5 database need for SMT process
Function of three-terminal capacitor
Introduction of PCB OSP surface treatment
Method of inspecting the quality of SMT by step
How to find the short point between VCC and GND
Difference between 850nm and 940nm infrared LED
Component layout of PCB SMT DFM
Pad shape influence on the strength and reliability of the soldering joints
The difference between high temperature solder paste and low temperature solder paste
Introduction to manual welding processing
Manual visual inspection in PCBA processing
Characteristics of the conformal coating process
Difference between hardware engineers and software engineers
PCBA processing operation rules
China PCB upstream materials has continued to soar
Difference between serial buses and parallel buses
The key points of quality control in PCBA processing
Common causes of solder beading during SMT process
Analysis of the advantages and disadvantages of HASL PCB surface
Requirements for layout of components during SMT assembly
Selection of electronic components and CCL for PCBA
Performance and appearance quality inspection of components.
Quality and Reliability of SMT Chip Processing and Production
Coupling and decoupling function of capacitor
Two methods to connect digital ground and analog ground
Common sense in SMT process

methods to improve the efficiency of FPC testing

As electronic products such as mobile phones and tablets are gradually becoming thinner and lighter, the demand for FPC has also increased. Due to its ultra-thin, high density, high reliability, and bending resistance, in electronic product, FPC is mainly used in circuit connection, it is one of the important materials for the thin design of electronic products. FPC can save redundant cables, reduce the volume and weight of the product, has high flexibility and can be assembled in a limited space. In the FPC manufacturing process, FPC testing is indispensable. In order to improve the good yield of FPC products and prevent defective products from entering the market, testing can be conducted from the three aspects of FPC appearance, process and performance, which will help to find existing defects of FPC in time, and make improvements based on the defects, thereby increasing the good yield of FPC products and reducing costs.

FPC testing can use shrapnel micro-needle modules as connection modules to achieve the purpose of improving test efficiency. The shrapnel micro-needle module is a one-piece shrapnel design, which is very strong adaptable in the field of small pitches. It can cope with the pitch value between 0.15mm-0.4mm and has stable and reliable performance. It will not jam or break the needle, can maintain long-term connection and current transmission. When transmitting current, the shrapnel micro-needle module can pass a large current of 50A, and the current flows in the same material body, with stable over current, constant voltage, no current attenuation, and good connection function. Its service life can reach an average of more than 20w times. It is a long-life module. It does not need to be replaced frequently during use, and its performance is very stable. In the FPC test, it not only has high adaptability, but also high test efficiency.

The basic standards of FPC testing can be divided into the following points:

1. The appearance of the FPC substrate film: check the appearance of the substrate for creases, wrinkles, bumps and foreign matter, etc., which will affect the performance of the FPC.

2. The appearance of the FPC covering layer: the surface of the appearance should not have defects such as bumps, wrinkles, creases, delamination, etc., any of them belong to the scope of defective products.

3. The deviation of the FPC connecting plate and the covering layer: the standard is that the deviation is ±0.3mm or less when the external dimension is less than 100mm, and the allowable deviation is less than ±0.3% of the external dimension when the external dimension is more than 100mm.

4. Missing coating of FPC coating: It needs to be tested in accordance with the solderability requirements of FPC. For the missing part of the coating, tin should not be stuck on the conductor.

5. Discoloration under the conductor of the FPC covering layer: The FPC is required to have the performance requirements of voltage resistance, welding resistance, and bending resistance after passing the humidity resistance test at a temperature of 40°C, a humidity of 90%, and a 96-hour period.

6. The seepage of FPC adhesive and covering layer: The seepage degree should be less than 0.2mm. At the connecting plate, the deviation of FPC covering layer and punching should reach the standard of minimum ring width g≥0.05mm.

7. FPC electroplating bonding: It is required that the FPC electroplating layer cannot be delamination, and the poor bonding of the plating layer cannot destroy the reliability of the FPC contact area.

Testing is the best way to control the good yield of FPC products. The shrapnel micro-needle module is the best aid for FPC testing. Mastering the basic standards of FPC testing is conducive to the stability of FPC testing, and it can also improve the testing efficiency of FPC, so that FPC give full play to the best performance.