PCB Material Development_
Technical
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PCB Material Development

In PCB industry structure rigid PCB account for 70%, it is the largest, there are four main rigid PCB material to be used in the manufacturing process: CCL (CCL), copper foil, film and all kinds of chemicals, which CCL accounted for the highest proportion of raw material costs, attributable to the costs proportion between 50% to 70%, depending on the number of layers, copper substrate material is mainly fiberglass cloth and electrolytic copper.

Rigid board account for 70% of Printed circuit board (PCB) industry structure as the largest, hard board material to be used in the manufacturing process, there are four main: CCL (CCL), foil, film and all kinds of chemicals, CCL which accounted for the highest proportion of raw material costs, depending on the number of layers of costs attributable to the proportion between 50% to 70%, mainly copper substrate material is fiberglass cloth and electrolytic copper foil.


Fiberglass cloth, copper and electrolytic copper foil substrate materials are the main material of  printed circuit board.


There are a lot of advantages with HDI PCB, such as small size, high speed and high frequency. It is the main components of personal computers, portable computers, mobile phones and personal digital assistants. At present, except mobile phones, HDI PCB is also widely used in a variety of other consumer products, such as game consoles and MP3, etc. In addition, the applying of HDI PCB in notebook computer is expected trend since 2006 is in the industry.