PCB Shielding case Design Guide_
Chinese CCL production capacity increase recent years
solution to the 32.768kHz crystal oscillator cannot oscillate
Challenge of energy conservation and environmental protection to the development of PCB
Limata's innovative LUVIR technology
Development prospect of LED plant lighting market
TPCA promotes PCB-ECI standardization
20H principle in PCB design
3W principle in PCB design
China's PCB output value will increase 2022
PCB equipment business prospects are promising
Automotive intelligence and electrification, PCB will obtain opportunity
Analysis of the reason why the pad is easy to fall off when the circuit board is soldered
Introduction to BGA Technology
What causes the print circuit board (PCB) trace open?
How to solve the problem of Rigid-Flex PCB expansion and shrinkage?
What will happen to the PCB industry in 2019?
2018 PCB Development Focus
PCBA circuit board Industry Recent Situation
2020 China SMT industry development situation
Evolution of THT plug-in process and SMT process
2015 PCB market grow slowly
Copper foil price rise 30% in few months
PCB factories facing upstream price rising
HDI and FPC growth fast in hot season
Japanese PCB industry consecutive 8months decline
AOI application in electronic manufacturing service
Parts placement precautions of double side reflow PCB
Analysis and improve of open defect in PCB
PCB panelization method
CCL and PCB price expected to increase
FPC new trend and application
Russia will Spurn AMD, Intel for Locally-Made Processors
Japan PCB industry 5months decline in 2016
Korean PCB industry in 2015&2016
Current challenges and opportunities of PCB chemicals
Taiwanese PCB industry grow slowly in 2016
HDI and FPC enable IoT
PCB factories are moving out from Shenzhen
Latest PCB industry China
High end PCB is popular in recent years
Nippon Mektron FPCB manufacturing supported Orbotech
Production capacity expanding raise PCB market concern
Choice for location of fiber glass factories
Fast development in East and South Asia PCB industry
Technical gap between Mainland China and Taiwan PCB industry
Deficiencies of small and medium China domestic PCB enterprises
Taiwan PCB enterprises into automotive PCB industry
Shenzhen to be the World’s PCB trading center
2015 Q3 Taiwan PCB production value released by TPCA
Moving in to inland regions, PCB industry pattern is changing in China
Challenge of PCB from Wearable electronics
Innovation in PCB manufacturing technology
Chinese PCB industry growth trend
2014 Global PCB output reach $60.2 Billion
Flexible PCB grow fast in Japan PCB industry
PCBA turnkey service is a New Trend in PCB manufacturers
Revolution SMT brings to Electronics
China Local PCB maker compete with Taiwan maker in HDI
Time to Build China PCB industrial Brand
Scanning the electromagnetic waves in printed circuit board
Develop trends in integrated circuit industry
PCB market growing in 2016
Impact of CNY Devaluation on China PCB industry
RF power Device market grow rapid in 2015
Advantage of SysPCB
HDI flexible pcb new trends in 2015
PCB Material Development
New material for flexible PCB
Express PCB Manufacturer
Taiwan PCB manufacturers expending, orders from China IT Company
Demands of mobile boards become weakness
PCB material supplier of high-frequency active layout of the front-end
ARLON high-frequency material
See through the design connotation of Aiptek’s pocket projector
Introduction of the printed circuit board PCB material
HDI PCB news
PCB Shielding case Design Guide
Power management
How to choose MOSFET
Electronic design automation
PCBA product storage period

PCB Shielding case Design Guide

PCB Shielding case Design Guide

In the design of RF hardware, electromagnetic interference needs to be considered, and the design of the shielding case is essential. Today's article the Shenzhen PCB manufacturer - SysPCB will introduces the design specifications of shielding case and the types.
Some notes about the design of the shield case are as follows:
1. The material of the shield case can be zinc-tin-nickel-alloy or copper-nickel-zinc alloy (good performance and easy processing) or stainless steel (only shield cover). The material of the shielding frame is zinc-tin-nickel-alloy or copper-nickel-zinc alloy to ensure good welding performance. Material thickness is generally between 0.1-0.2mm, 0.2mm is more commonly used.
2. Shielding case pad width is between 0.7-1mm.
3. Design of heat dissipation holes: When considering heat dissipation, heat dissipation holes need to be added. The hole diameter is generally between 1-1.5mm, and the hole spacing is about 5mm.
4. When considering batch soldering, it is necessary to reserve a vacuum washing area in the middle of the shield case (guaranteed to be a flat surface and no holes), generally the diameter of this area is not less than 5mm.
5. The component’s pad should be at least 0.3mm away from the edge of the shielding case pad.
6. When soldering, consider the solder height of 0.1mm, and at least 0.2mm above the top of the shielding case.
7. 2-1-2-1mm mode design: Soldering of the shielding case as far as possible not whole soldering, so it will cause tin stacking. Generally 2-1-2-1mm mode is adopted, with 2mm contact and 1mm suspension for easy tin climbing, which can ensure the adhesion strength of the shielding case.
8. If the shielding case is of symmetrical shape, you need to add positioning holes or regular triangle lines.
Regarding the soldering form of the shielding case, there are currently three main types as follows:
Single piece soldering
The single piece is directly soldered to the circuit board, and the single piece is easy to process and the cost is low. The biggest disadvantage is that once soldering is not easy to remove, it makes maintenance and debugging more difficult.

Two pieces of detachable soldering type
The two-piece type is composed of a frame and a cover. The frame is generally made of copper-nickel-zinc alloy for easy soldering, and the cover is generally made of stainless steel, which is cheaper.
The advantage of the two-piece type is that it is convenient for maintenance and inspection. The disadvantage is that it needs to open the mold twice and the cost is higher.

Shielding case clip + single shielding case
Now the shielding case clip is used instead of the frame, which can save the mold opening cost of the frame. The shielding case clip is fastened by the buckle. At least 4 pieces are required, which can be implemented flexibly. The disadvantage of this solution is that the clamping force of the buckle needs to be studied, and it is not suitable for use in scenarios with high vibration intensity.

Conclusion: According to the characteristics of the above schemes, a suitable design scheme needs to be selected in combination with actual application scenarios.