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Analysis of the reason why the pad is easy to fall off when the circuit board is soldered

During the soldering process of the circuit board, the pad peeling often occurs. Especially when the circuit board is reworked, when the soldering iron is used, the phenomenon of the pad falling off is very easy....
 

Introduction to BGA Technology

The BGA technology research began in the 1960s and was first adopted by IBM in the United States, but it was not until the early 1990s that the BGA really entered the practical stage....
 

What causes the print circuit board (PCB) trace open?

In the production process of the print circuit board, the circuit boards produced by various conditions often fail to meet the requirements. For example, print circuit board trace open is often encountered....
 

How to solve the problem of Rigid-Flex PCB expansion and shrinkage?

The root cause of the expansion and shrinkage is determined by the characteristics of the material....
 

What will happen to the PCB industry in 2019?

For 2019, the PCB industry's optimism over the past few months is now much more conservative...
 

2018 PCB Development Focus

2018 PCB Development Focus, Environmental pressure is the basic premise for Shenzhen China PCB companies to survive...
 

PCBA circuit board Industry Recent Situation

Since 2017, the overall PCB industry has picked up, and the supply demand of the industrial chain has undergone profound changes. We think the current PCB industry is in a new round of prosperous business cycle...
 

2020 China SMT industry development situation

The situation of the China SMT pick and place machine industry. China is now a global electronics manufacturing and processing center....