SMT Capability_

SMT Capability

Capability of Components Assembly

Item Mass  production (mm) Sample& Small order (mm)
SMT PCB Length*Width Min. 50*30 L50 Or W30
Max. 450*350 450L800 Or 350W400
Thickness Min. 0.8 T0.8
Max. 5 T5
DIP PCB Length*Width Min. 50*30 L50
Max. 500*300 500L1000 Or 300W450
Thickness Min. 0.8 T0.8
Max. 5 T5
Surface Mount Device Size Min. 06030201 040201005
Max. 45*45 45*45Size68*6845*150
Thickness 25.4 T25.4
QFP/SOP/SOJ/IC/Socket etc. Min. PIN Distance Pitch=0.4 Pitch=0.3
CSPBGA Min. Tin Ball Distance Pitch=0.5 0.3Pitch0.5
PCB Type FR4FPCRigid-Flex PCBMetal Core PCB