ZIF connector, Zero Insertion Force, PCB/FPCB design, Flexible Printed Circuit board, Shenzhen SMT placement, shenzhen Reflow soldering, Shenzhen PCB manufacturer, Shenzhen SMT process, Shenzhen Assembly manufacturer, Shenzhen PCB factory, Shenzhen SMT factory, China PCBA manufacturer
ZIF connector

What is ZIF connector?

ZIF is the abbreviation of Zero Insertion Force, a type of connector, with no specific size.

Characteristic of ZIF connector

1. ZIF expands the product for the terminal FPC connector SFGL series.

2. ZIF and non-zero insertion force, upper and lower contact options, vertical and right-angle directions, surface mount and through-hole welding packaging technology have been expanded to 0.20 mm pitch.

3. ZIF has high reliability and low signal crosstalk. DLP series connectors can be connect and insert to 10,000 times without loss of performance, and can be finished within two seconds. Because the contact point is in the socket, it can be directly connected to the PCB, thereby reducing the signal path and crosstalk.

Classification of ZIF connector

1. Classified by locking structure:

1-1, Front lock
1-2, Back lock


2. According to the type of plug finger:

2-1, Single row terminal
2-2, Double row terminal


3. According to the thickness of the plug finger:

3-1, 0.2mm±0.03mm
3-2, 0.3mm±0.03mm
3-3, 0.1mm±0.03mm


PCB/FPCB design

1. In order to ensure the mechanical strength of the terminal welding part, the general pad design refers to the recommended pad design in the specification book. If the recommended pad design is unreasonable, it can be optimized and adjusted according to the process capability (to ensure the welding strength of the terminal welding part).

2. In order to ensure the mountability of the ZIF connector, for the PCB/FPCB board, the bow and twist of the PCB/FPCB board should be controlled as much as possible during the design and manufacturing process.


3. When designing, attention should be paid to the distance from the PCB/FPCB board shape to the solder pins of the component. When cut connection point after the ZIF connector is mounted, excessive stress will be applied to the connector, which will cause damage to the connector body.

Design of FPC plug finger

1. In order to ensure the performance of the ZIF connector, it is recommended to design according to the recommended size in the specification.

2. The avoidance design of the cutting die and test tooling ensures that the lock cover and the device body will not be damaged by the pressure of the tooling tool when the lock cover of the ZIF connector is open.

SMT placement

1. When SMTing, the suction nozzle should avoid the position of the lock cover when sucking the device.

2. When mounting, the downward mounting force should be small. The mounting height should be determined according to the height of the device. When contacting the PCB/FPCB surface, the device is placed on the PCB/FPCB surface by compressed air pressure.

Reflow soldering

1. In order to achieve an appropriate soldering state, refer to the device recommendations for the conditions of the reflow furnace (FPCB/PCB pad size, steel mesh thickness, steel mesh opening size, reflow furnace temperature conditions (furnace temperature curve)). When the amount of solder in the solder terminal part is too much, it may interfere with the insertion of the FPC, or cause excessive soldering, solder resist overflow, or too much tin climbs to the upper surface of the terminal, resulting in a defective board.

2. It is recommended to control the number of reflow soldering to less than 2 times. Before the second reflow soldering, pay attention to avoid touching the lock cover (avoid applying external force). Touching the lock cover (applying external force causes the lock cover to close) the contact spring begins to bend. In this case, reflow soldering will cause deformation of the terminal.

3. Due to different conditions of the reflow furnace, poor contact may be caused due to excessive soldering and solder resist overflow. When setting the temperature of the reflow furnace, the characteristics of solder and solder resist should be considered.