Two common soldering methods in PCB, reflow soldering, wave soldering, shenzhen PCBA manufacturer, shenzhen PCB assembly, shenzhen PCB manufacturer, solder paste, placement components, printed circuit boards, solder through-hole components, DIP, solder components, SMD electronic components
Two common soldering methods in PCB: reflow soldering and wave soldering

There are two common soldering methods in PCBA processing: reflow soldering and wave soldering.

What is the function of reflow soldering, and what is the function of wave soldering What is the difference between them?

1. Reflow soldering

Reflow soldering is the process of temporarily soldering using solder paste (a viscous mixture of powdered solder and flux) or connecting thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state to form a permanent solder joint. Heating can be accomplished by passing the assembly through a reflow oven or infrared lamp, or by soldering a single joint [unconventional] with a desoldering hot air pen.

Reflow soldering process: printed solder paste > placement components > reflow soldering >cleaning.


2. Wave soldering

Wave soldering is a batch soldering process used to printed circuit boards. The board passes through a molten solder disk where the pump produces a solder surge that looks like a standing wave. When the board is in contact with the wave, the component is soldered to the board. Wave soldering is used for through-hole printed circuit assembly and surface mounting. In the latter case, the parts are glued to the surface of the printed circuit board (PCB) by placement equipment prior to passing through the molten solder wave. Wave soldering is mainly used to solder through-hole components.

Wave soldering process: DIP>flux>preheating>wave soldering>cutting foot>check.
 


 

3. The difference between wave soldering and reflow soldering

(1) Wave soldering is a solder that can solder components;
Reflow soldering is a high-temperature hot air that forms a reflowed molten solder and solders components.

(2) During the reflow soldering process, there is solder on the PCB before the furnace, and only the applied solder paste is melted and soldered after soldering;
During the wave soldering process, there is no solder on the PCB in front of the furnace, the solder wave generated by the soldering machine applied the solder on the pads to be soldered to complete the soldering.

(3) Reflow soldering is suitable for SMD electronic components, and wave soldering is suitable for pin electronic components.