Advantages and disadvantages of flying probe test, prototype assembly, test low-volume UUTs, prototype PCB, Shenzhen PCB manufacturer, Rapid test development, Lower cost test methods, flexible PCB, In Circuit Tester, ceramic PCB manufacturer, needle bed tester, double-sided PCB, PCB mass production factory, shenzhen PCBA manufacturer
Advantages and disadvantages of flying probe test

Because flying probe test ease to program, ability to test prototype assembly in hours, and test low-volume UUTs without typical fixture development costs, flying probe testing solves many of the problems in a production environment. But not all production test problems can be solved by using the flying probe test.

Let's take a look at the advantages and disadvantages of flying probe testing:


1. Rapid test development;

2. Lower cost test methods;

3. Flexibility in fast conversion;

4. Provide quick feedback to designers during the prototype phase

Compared with traditional ICT (In Circuit Tester), the time required for the flying probe test can be compensated by reducing the total test time. The benefits of using a flying probe test system outweigh the disadvantages. For example, during the assembly process, flying probe test system can start work a few hours after receiving the CAD file. As a result, the prototype board can be tested in a few hours after assembly, unlike ICT, where costly test development and fixtures can delay the process for days, even months. In addition, because of the simplicity and speed of setup, programming, and testing, in fact, the general technical assembler, not the engineer, can operate the test. Flying probe testing also has the flexibility to quickly test conversion and quickly respond process errors. Also, because the flying probe test does not require fixture development costs, it is a low-cost system that can be placed in front of a typical test process. And because the flying probe tester changes the test method for low-volume and fast-conversion assembly, tests that typically take weeks to develop can now be obtained in a few hours.


1. Because the test probe is in physical contact with the via and the solder on the test pad, small pits may be left on the solder. For some OEM customers, these small pits may be considered defective in appearance, causing rejection receive. However, some high-end flying probe test equipment manufacturers have developed new technologies. Using a "soft landing" can avoid leaving obvious pits on the solder and even testing on ceramic PCB.

2. Because sometimes the probe will touch the component pins where there are no test pads, you may miss loose or poorly soldered component leads.

3. The probe tester limits the size of the board, it cannot exceed 16inch * 24inch (406*610mm). The current SPEA's maximum test range is up to 27inch * 24inch (686*610mm).

4. Time is another major factor. A typical needle bed tester may take 30 seconds to test the UUT. The flying probe tester may take 8-10 minutes.

5. The needle bed tester can simultaneously test the top and bottom components of the double-sided PCB using the top clamp, while the flying probe tester requires the operator to test one side, then flip, and then test the other side, thus seeing the flying probe test does not adapt well to the requirements of mass production.