PCBA cleaning precautions, Printed circuit board assembly, SMT+THT process, PCBA soldering process
PCBA cleaning precautions

Printed circuit board assemblies should be cleaned as soon as possible after soldering (because the flux residue hardens over time and forms corrosives such as metal halides), completely removing residual flux, solder and other contaminants from the printed board.

During cleaning, prevent harmful cleaning agents from entering the components that are not completely sealed to avoid damage or potential damage to the components. After the printed circuit board assembly is cleaned, it is baked in a 40~50*C oven for 20~30 minutes. Before the cleaning parts are not dried, the bare hand touch device is not applied. Cleaning should not affect components, markings, solder joints, and printed circuit boards. The assembly of general electronic products PCBA is subject to the SMT+THT process, during which wave soldering, reflow soldering, manual soldering and other soldering processes are required. No matter the way of soldering, the assembly (electrical assembly) process is the main source of assembly pollution. Cleaning is the dissolution removal process of a solder residue. The purpose of cleaning is to extend the life of the product in essence by ensuring good surface resistance and preventing leakage.

As you can see from the evolving electronics market, modern and future electronics will become smaller and smaller, and the requirements for high performance and reliability will be stronger than ever. Thorough cleaning is a very important and highly technical work that directly affects the working life and reliability of electronic products, as well as the protection of the environment and human health. It is necessary to re-understand and solve the problem of solder cleaning from the perspective of the entire production process system. The implementation of the solution should be combined with the use of solder materials such as flux, solder paste, solder wire, etc., so that the organic solvent, inorganic solvent and its mixed solvent or water are washed or No-cleaning is matched to effectively remove the residue, making the cleaning cleanliness easier to meet customer expectations.