Maintain high quality and efficiency SMT by optimizing PCB design
Maintain high quality and efficiency SMT by optimizing PCB design

As a leader in the field of express PCB assembly in Shenzhen China, SYS Tech committed to providing customers with small and medium-sized SMT PCB assembly production.
Adopting industry-leading multi-functional SMT machine, 10-temperature zone reflow oven, equipped with wave soldering, BGA rework station, AOI, X-RAY testing machine, 5 SMT production lines, 2 through hole soldering lines, own a complete set of assembly and testing lines.
 
This article describes some of the details that need to be noted in the PCB design for manufacturing.
1. Fiducial marks are to be round or square, with a diameter of 1.0mm, which can be detected by pick and place equipment easily. Distance from fiducial marks to the surrounding copper should be more than 2.0mm, Fiducial marks are not allowed crease, dirt and copper exposing etc. issues
2. There should be a fiducial mark on each of the four corners of board or two marks on the opposite corner. The marks must be more than 5mm distance from the edge.
3. Each small board must have at least two fiducial marks.
4. According to the specific equipment and efficiency evaluation, sometimes, it is not allowed X-out board in the bare PCBs supplied
5. The 0402 component pads pitch is 0. 4mm, 0603 and 0805 component pads pitch is 0.6mm, the pads are preferably square shape.
6. After PCB board is made, it must be vacuum-packed before SMT. PCB must be pre-baked if PCB out of shelf life and a first article must made and checked before mass assembly.
7. The size of the PCB panel is preferably within 200mm*150mm.
8. There must be 4 SMT positioning holes on the edge of the panel, the holes diameter is 2.0mm.
9. The minimum distance between the edge of the panel to SMD components is 10mm.
10. Each small piece PCB in panel to be distributed in the same direction if possible.
11. The distance between the chip component pads is a minimum of 0.5mm.
 
PCB designers and PCB SMT engineers all have the experience of SMT soldering issues after the completion of bare PCB manufacturing.
The problem is that as an excellent designer, by knowing some special requirements in SMT process in advance, is possible maintain high quality and efficiency during SMT process by optimizing PCB design.
Precision SMT process has a very high requirement for the flatness of the board, in addition, the spacing of each board in Panel, the fiducial point placement, the size of the board, etc. all affect the quality and efficiency of the SMT.
So PCB design engineers should know more about manufacturing requirements. Comprehensively consider the design with some special SMT requirements and PCB manufacturing ability.